MCC
Micro Commercial Components
TM
omponents
20736 Marilla
Street Chatsworth
!"#
$% !"#
BAS19
THRU
BAS21
Small
Signal Diodes
250mW
SOT-23
A
D
Features
Ideally Suited for Automatic Insertion
150
o
C Junction Temperature
Fast Switching speed
Epitaxial Planar Die Construction
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Weight: 0.008 grams ( approx.)
Continuous
Reverse
MCC Part
Marking
Voltage
Number
V
R
(V)
BAS19
BAS20
BAS21
JP
JR
JS
100
150
200
Repetitive
Peak
Reverse
Voltage
V
RRM
(V)
120
200
250
G
Top View
3
C
B
1
2
F
E
H
J
K
DIMENSIONS
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Parameter
Symbol Value
@ t=1us
2.5
Non-repetitive Peak
I
FSM
Forward Surge Current @ t=1s
0.5
I
F(AV)
Average Rectified Forward Current
200
(1)
I
F
Forward DC Current at T
amb
=25
o
C
200
(2)
Repetitive Peak Forward Current
I
FRM
625
Unit
A
mA
mA
mA
DIM
A
B
C
D
E
F
G
H
J
K
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
P
tot
250
mW
Power Dissipation up to T
amb
=25
o
C
Thermal Resistance Junction to
R
q
JA
430
o
C/W
Ambient
Operating & Storage Temperature T
j
, T
STG
-65~150
o
C
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
Notes:
(1) Measured under pulse conditions;
Pulse time = t
p
<= 0.3ms
(2) Device on fiberglass substrate,
See layout on next page
.037
.950
.037
.950
Revision:
A
www.mccsemi.com
1 of 3
2011/01/01