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BAS40-05 参数 Datasheet PDF下载

BAS40-05图片预览
型号: BAS40-05
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装肖特基二极管200 mWatt [Surface Mount Schottky Barrier Diode 200 mWatt]
分类和应用: 肖特基二极管光电二极管
文件页数/大小: 4 页 / 263 K
品牌: MCC [ Micro Commercial Components ]
 浏览型号BAS40-05的Datasheet PDF文件第2页浏览型号BAS40-05的Datasheet PDF文件第3页浏览型号BAS40-05的Datasheet PDF文件第4页  
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$%    !"#
BAS40
THRU
BAS70
Surface Mount
Schottky Barrier Diode
200 mWatt
SOT-23
A
D
Features
SOT-23 Package For surface mount application
Protects from line to V
CC
and line to ground
Low forward voltage and reverse recovery characteristics
Bidirectional-low-forward available with “ -04” suffix (Figure 2)
Tape & Reel EIA Standard 481.
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Mounting Position: Any
Weight: .008 grams (approx.)
C
B
MAXIMUM RATINGS
Operating Temperature: -55 C to +125 C
Storage Temperature: -55 C to +150 C
Power Dissipation: 200 mWatts @ T
amb
=25 C
BAS40
o
o
I
FM
=200mA
@
T
a
=
25 C
o
I
FM
=70mA
@
T
a
=
25 C
G
H
J
o
o
F
E
o
o
Forward Continuous Current:
BAS70
o
Surge Forward Current: 600mA @ t
p
<1s, T
amb
=25 C
K
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
DESCRIPTION
Various configurations of Schottky barrier’ s diodes in SOT-23
package are provided for general-purpose use in high-speed
switching ,mixers and detector applications. They may also be
used for signal integrity and counteract the transmission-line
effects with (PC) board trances by clamping over/and undershoot
from signal reflections with the schottky-low-threshold voltages.
This type of termination also does not depend on matching
the transmission line characteristic impedance, making it
particularly useful where line impendance is unknown or a
variable. This methode of termination can control distortions of
clock, data, address, and control lines as well as provides a
stabilizing effect on signal jitter. It can also significantly reduce
power consumption compared to standard resistor-based
termination methods.
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision:
A
www.mccsemi.com
1 of
4
2011/01/01