MCC
Features
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omponents
21201 Itasca Street Chatsworth
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BZX84C2V4
THRU
BZX84C39
Silicon
410 mWatt
Zener Diodes
Planar Die construction
410mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
.
Mechanical Data
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Case: SOT-23, Plastic
Terminals: solderable per MIL-STD-202, Methode 208
Weight: 0.008 grams (approx.)
A
D
SOT-23
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
410
mWatt
(Note 1)
Operation And
T
J
, T
STG
-55
o
C to
Storage
+150
o
C
Temperature
Peak Foreard Surge
I
FSM
2.0
A
Current 8.3mS half
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
F
E
G
H
J
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
*Pin Configuration - Top View
.079
2.000
inches
mm
.037
.950
.037
.950
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