MCC
TM
Micro Commercial Components
•
Features
omponents
20736
Marilla
Street Chatsworth
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$% !"#
GS2A
THRU
GS2M
2.0 Amp
Silicon Rectifier
50 to 1000 Volts
•
•
•
•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low
Thermal Resistance
For Surface Mount Application
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Maximum Ratings
l
l
Operating Temperature: -55 C to +150 C
Storage Temperature: -55 C to +150 C
Maximum
Reccurrent
Peak
Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
o
o
o
o
o
DO-214AC
(HSMA) (High Profile)
Maximum
DC Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
F
G
E
H
Cathode Band
MCC
Catalog
Number
GS2A
GS2B
GS2D
GS2G
GS2J
GS2K
GS2M
Device
Marking
GS2A
GS2B
GS2D
GS2G
GS2J
GS2K
GS2M
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
J
A
C
D
B
Electrical Characteristics @ 25 C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous Forward
Voltage
Maximum DC Reverse
Current At Rated DC
Blocking Voltage
Typical Junction
Capacitance
Note:
DIMENSIONS
I
F(AV)
I
FSM
2.0A
50A
T
A
=75 C
8.3ms half
sine
I
FM
=2.0A
T
A
=25 C
o
DIM
A
B
C
D
E
F
G
H
J
o
V
F
1.10V
INCHES
MIN
.078
.067
.002
---
.035
.065
.205
.160
.100
MAX
.116
.089
.008
.02
.055
.096
.224
.180
.112
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
I
R
10.0uA
T
J
=25 C
o
SUGGESTED SOLDER
PAD LAYOUT
0.090”
C
j
20pF
Measured at
1.0MHz,
V
R
=4.0V
0.085”
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070”
.
Revision:
A
www.mccsemi.com
1 of 4
2011/01/01