MCC
Features
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omponents
21201 Itasca Street Chatsworth
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MMSZ5221B
THRU
MMSZ5259B
500 mW
Zener Diodes
2.4 to 39 Volts
Planar Die construction
500mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
Mechanical Data
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Case: SOD-123, Molded Plastic
Terminals: Solderable per MIL-STD-202, Method 208
Approx. Weight: 0.008 grams
Mounting Position: Any
Storage & Operating Temperature: -55 C to +150 C
o
o
SOD123
A
B
C
E
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
500
mWatt
(No te s A)
Pe ak Forward S urge I
FSM
4.0
Amps
Current (Not e s B)
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum
.
F
D
H
G
DIM
A
B
C
D
E
F
G
H
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.141
.154
3.60
3.90
.098
.110
2.50
2.80
.055
.071
1.40
1.80
.037
.053
0.95
1.35
.019
.028
0.50
0.70
---
.008
---
0.20
.016
---
0.40
---
---
.005
---
0.12
SUGGESTED SOLDER
PAD LAYOUT
2.0"
MAX
NOTE
1.50”
1.50”
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