MCC
Features
•
•
•
•
omponents
21201 Itasca Street Chatsworth
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S1A
THRU
S1M
For Surface Mount Applications
Extremely Low Thermal Resistance
Easy Pick And Place
High Temp Soldering: 250°C for 10 Seconds At Terminals
1 Amp
Silicon Rectifier
50 to 1000 Volts
DO-214AA
(SMBJ) (Round Lead)
H
Cathode Band
•
•
•
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 30°C/W Junction To Lead
MCC
Catalog
Number
S1A
S1B
S1D
S1G
S1J
S1K
S1M
Device
Marking
S1A
S1B
S1D
S1G
S1J
S1K
S1M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
DIM
A
B
C
D
E
F
G
H
J
J
A
C
E
F
G
D
B
DIMENSIONS
INCHES
MIN
.078
.075
.002
-----
.035
.065
.205
.160
.130
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
I
F(AV)
I
FSM
V
F
I
R
C
J
1.0A
30A
1.1V
5µA
50µA
12pF
T
J
= 100°C
8.3ms, half sine,
I
FM
= 1.0A;
T
J
= 25°C*
T
J
= 25°C
T
J
= 125°C
Measured at
1.0MHz, V
R
=4.0V
MAX
.116
.089
.008
.02
.055
.091
.224
.180
.155
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
*Pulse test: Pulse width 300
µsec,
Duty cycle 2%
0.070”
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MCC [ Micro Commercial Components ]
