MX29F200T/B
READ/RESET COMMAND
The read or reset operation is initiated by writing the
read/reset command sequence into the command reg-
ister. Microprocessor read cycles retrieve array data.
The device remains enabled for reads until the com-
mand register contents are altered.
If program-fail or erase-fail happen, the write of F0H will
reset the device to abort the operation. A valid command
must then be written to place the device in the desired
state.
SET-UP AUTOMATIC CHIP/SECTOR ERASE
COMMANDS
Chip erase is a six-bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"set-up" command 80H. Two more "unlock" write cycles
are then followed by the chip erase command 10H.
The Automatic Chip Erase does not require the device
to be entirely pre-programmed prior to executing the
Automatic Chip Erase. Upon executing the Automatic
Chip Erase, the device will automatically program and
verify the entire memory for an all-zero data pattern.
When the device is automatically verified to contain an
all-zero pattern, a self-timed chip erase and verify begin.
The erase and verify operations are completed when the
data on Q7 is "1" at which time the device returns to the
Read mode. The system does not require to provide
any control or timing during these operations.
When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array(no
erase-verified command is required).
If the Erase operation was unsuccessful, the data on Q5
is "1"(see Table 4), indicating an erase operation exceed
internal timing limit.
The automatic erase begins on the rising edge of the last
WE pulse in the command sequence and terminates
when the data on Q7 is "1" and the data on Q6 stops
toggling for two consecutive read cycles, at which time
the device returns to the Read mode.
SILICON-ID-READ COMMAND
Flash memories are intended for use in applications
where the local CPU alters memory contents. As such,
manufacturer and device codes must be accessible
while the device resides in the target system. PROM
programmers typically access signature codes by rais-
ing A9 to a high voltage. However, multiplexing high
voltage onto address lines is not generally desired
system design practice.
The MX29F200T/B contains a Silicon-ID-Read opera-
tion to supplement traditional PROM programming meth-
odology. The operation is initiated by writing the read
silicon ID command sequence into the command regis-
ter. Following the command write, a read cycle with
A1=VIL,A0=VIL retrieves the manufacturer code of C2H/
00C2H. A read cycle with A1=VIL, A0=VIH returns the
device code of 51H/2251H for MX29F200T, 57H/2257H
for MX29F200B.
TABLE 3. EXPANDED SILICON ID CODE
Pins
Manufacture code
Device code
for MX29F200T
Device code
for MX29F200B
Sector Portection
Verification
Word
Byte
Word
Byte
Word
Byte
A0
VIL
VIL
VIH
VIH
VIH
VIH
X
X
A1
VIL
VIL
VIL
VIL
VIL
VIL
VIH
VIH
Q15~Q8 Q7
00H
X
22H
X
22H
X
X
X
1
1
0
0
0
0
0
0
Q6
1
1
1
1
1
1
0
0
Q5
0
0
0
0
0
0
0
0
Q4
0
0
1
1
1
1
0
0
Q3
0
0
0
0
0
0
0
0
Q2
0
0
0
0
1
1
0
0
Q1
1
1
0
0
1
1
0
0
Q0
0
0
1
1
1
1
1
0
Code(Hex) Code
00C2H
C2H
2251H
51H
2257H
57H
01H(Protected)
00H(Unprotected)
P/N:PM0549
REV. 1.3 , DEC. 24, 2001
8
MCNIX [ MACRONIX INTERNATIONAL ]
