ECO-PAC
TM
2
IGBT Module
Preliminary Data Sheet
PSSI 45D/06
PSSI 46D/06
I
C80
= 48 A
V
CES
= 600 V
V
CE(sat)typ.
= 2.3 V
FH 13
A1
RT 16
IK 10
EG 1
IK 10
FH 13
A1
VX 18
RT 16
VX 18
LN 9
PSSI 45D/06
IGBTs
Symbol
V
CES
V
GES
I
C25
I
C80
I
CM
V
CEK
t
SC
(SCSOA)
P
tot
Symbol
T
C
= 25°C
T
C
= 80°C
V
GE
= ±15 V; R
G
= 22
Ω;
T
VJ
= 125°C
RBSOA, Clamped inductive load; L = 100 µH
V
CE
= V
CES
; V
GE
= ±15 V; R
G
= 22
Ω;
T
VJ
= 125°C
non-repetitive
T
C
= 25°C
Conditions
(T
VJ
V
CE(sat)
V
GE(th)
I
CES
I
GES
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
C
ies
R
thJC
R
thJH
Conditions
T
VJ
= 25°C to 150°C
Maximum Ratings
600
± 20
69
48
100
V
CES
10
208
V
V
A
A
A
µs
W
PSSI 46D/06
Features
•
•
•
•
•
•
Package with DCB ceramic
base plate
Isolation voltage 3000 V
∼
Planar glass passivated chips
Low forward voltage drop
Leads suitable for PC board
soldering
UL registered, E 148688
Advantages
Characteristic Values
= 25°C, unless otherwise specified)
min.
typ. max.
2.3
2.8
4.5
2.8
6.5
0.8
4.4
100
50
55
300
30
1.8
1.4
2.8
1.2
V
V
V
mA
mA
nA
ns
ns
ns
ns
mJ
mJ
nF
0.6 K/W
K/W
•
•
•
•
•
I
C
= 75 A; V
GE
= 15 V; T
VJ
= 25°C
T
VJ
= 125°C
I
C
= 1 mA; V
GE
= V
CE
V
CE
= V
CES
;
V
GE
= 0 V;
T
VJ
= 25°C
T
VJ
= 125°C
Easy to mount with two screws
Space and weight savings
Improved temperature and power
cycling capability
High power density
Small and light weight
V
CE
= 0 V; V
GE
= ± 20 V
Inductive load, T
VJ
= 125°C
V
CE
= 300 V; I
C
= 40 A
V
GE
= 15/0 V; R
G
= 22
Ω
V
CE
= 25 V; V
GE
= 0 V; f = 1 MHz
(per IGBT)
with heatsink compound (0.42 K/m.K; 50 µm)
Caution:
These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
2002 POWERSEM reserves the right to change limits, test conditions and dimensions
POWERSEM GmbH, Walpersdorfer Str. 53
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20
MEDER [ MEDER ELECTRONIC ]
