EVB71111
868/915MHz Receiver
Evaluation Board Description
5
Package Description
The device TH71111 is RoHS compliant.
D
D1
24
25
A
17
16
b
E
E1
e
32
9
1
8
A2
A1
12°
c
+ 1°
0.25
(0.0098)
12°
+1°
L
.10 (.004)
Fig. 2:
LQFP32 (Low profile Quad Flat Package)
All Dimension in mm, coplanaríty < 0.1mm
E1, D1
min
max
min
max
7.00
E, D
9.00
A
1.40
1.60
0.055
0.063
A1
0.05
0.15
0.002
0.006
A2
1.35
1.45
0.053
0.057
e
0.8
b
0.30
0.45
0.012
0.018
c
0.09
0.20
0.0035
0.0079
L
0.45
0.75
0.018
0.030
α
0°
7°
0°
7°
All Dimension in inch, coplanaríty < 0.004”
0.276
0.354
0.031
5.1
Soldering Information
•
The device TH71111 is qualified for MSL3 with soldering peak temperature 260 deg C
according to JEDEC J-STD-2.
39012 71111 01
Rev. 011
Page 13 of 14
EVB Description
June/07
MELEXIS [ Melexis Microelectronic Systems ]
