EVB71121
300 to 930MHz Receiver
Evaluation Board Description
6
Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture
sensitivity level, as defined in this specification, according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)”
•
EIA/JEDEC JESD22-A113
“Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles
according to table 2)”
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
“Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat”
EIA/JEDEC JESD22-B106 and EN60749-15
“Resistance to soldering temperature for through-hole mounted devices”
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
“Resistance to soldering temperature for through-hole mounted devices”
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
“Solderability”
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of
the Use of Certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality_leadfree.aspx
7
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
39012 71121 01
Rev. 003
Page 16 of 18
EVB Description
Jan/08
MELEXIS [ Melexis Microelectronic Systems ]
