EVB72036
868/915MHz FSK/ASK Transmitter
Evaluation Board Description
6 Package Description
The device TH72016 is RoHS compliant.
D
10
6
L
0.23
E
E2
exposed pad
0.36
D2
0.225x45°
1
5
A3
b
e
A
A1
The “exposed pad” is not connected
to internal ground,
it should not be connected to the PCB.
Fig. 7:
all Dimensions in mm
D
min
max
2.85
3.15
10L QFN 3x3 Dual
E
2.85
3.15
D2
2.23
2.48
E2
1.49
1.74
A
0.80
1.00
A1
0
0.05
A3
0.20
L
0.3
0.5
e
0.50
b
0.18
0.30
all Dimensions in inch
min 0.112 0.112 0.0878 0.051 0.0315
0
0.0118
0.0071
0.0079
0.0197
max 0.124 0.124 0.0976 0.055 0.0393 0.002
0.0197
0.0118
6.1 Soldering Information
•
The device TH72036 is qualified for MSL3 with soldering peak temperature 260 deg C
according to JEDEC J-STD-20
6.2
Recommended PCB Footprints
X
Y
10
6
Y
R
A
IN
IM
L
E
R
P
e
C
PL
all Dimensions in mm
Z
min
max
3.55
3.90
G
1.9
2.3
D2
th
3.2
3.6
E2
th
1.3
1.7
X
0.25
0.30
Y
0.7
1.0
C
PL
0.3
0.5
e
0.5
Z G
1
5
E2
th
all Dimensions in inch
min 0.1398 0.0748 0.1260 0.0512 0.0098 0.0276 0.0591
0.0197
max 0.1535 0.0906 0.1417 0.0669 0.0118 0.0394 0.0197
D2
th
solder pad
solder stop
Fig. 8:
PCB land pattern style
3901272036 01
Rev. 002
Page 10 of 12
EVB Description
June/07
MELEXIS [ Melexis Microelectronic Systems ]
