MLX90277
Dual Programmable Linear Hall Effect Sensor
Table of Contents
1 Functional Diagram ........................................................................................................... 1
2 General Description .......................................................................................................... 1
3 Glossary of Terms............................................................................................................. 3
4 Maximum Ratings ............................................................................................................. 3
5 Detailed Block Diagram..................................................................................................... 4
5.1 Detailed Description .................................................................................................... 4
6 General Electrical Specifications....................................................................................... 5
7 Programming Range ......................................................................................................... 6
8 Timing Specifications ........................................................................................................ 6
9 Accuracy ........................................................................................................................... 6
10 Programmable Features ................................................................................................. 7
10.1 Output Quiescent Voltage (V
OQ
)................................................................................ 8
10.2 Thermal V
OQ
Drift (DRIFT) ........................................................................................ 8
10.3 Sensitivity, Rough Gain and Fine Gain ..................................................................... 8
10.4 Sensitivity Range Selection....................................................................................... 9
10.5 Sensitivity Polarity (INVERT)................................................................................... 11
10.6 Clamping Levels (CLAMPLOW, CLAMPHIGH)....................................................... 11
10.7 Filter (FILTER) ........................................................................................................ 12
10.8 Sensitivity Temperature Compensation (TC, TCW, TC
2
) ........................................ 12
10.9 Diagnostic Output Level (FAULTLEV)..................................................................... 13
10.10 The EEPROM, Parity and Melexis CRC ............................................................... 13
10.11 Output Amplifier Configuration (MODE) ................................................................ 14
10.12 Memory Lock (MEMLOCK) ................................................................................... 14
10.13 IC traceability ........................................................................................................ 14
11 Performance Graphs..................................................................................................... 14
12 Applications Information................................................................................................ 15
12.1 Application Circuits.................................................................................................. 15
12.2 Programming the Sensor ........................................................................................ 16
12.3 Calibration Procedure ............................................................................................. 17
13 Standard information regarding manufacturability of Melexis products with different
soldering processes ........................................................................................................... 18
14 ESD Precautions........................................................................................................... 18
15 Package Information ..................................................................................................... 19
15.1 Package Dimensions .............................................................................................. 19
15.2 Pin-out and Marking ................................................................................................ 20
15.3 Hall Plate Positioning .............................................................................................. 20
16 Disclaimer ..................................................................................................................... 21
3901090277
Rev 004
Page 2 of 21
Data Sheet
Nov/06
MELEXIS [ Melexis Microelectronic Systems ]
