Transient
15
Series
MERITEK
F
EATURES
For surface mounted applications in order to optimize board space.
Low profile package.
Built-in strain relief.
Glass passivated junction.
Low inductance.
Excellent clamping capability.
Repetition Rate (duty cycle): 0.01%.
Fast response time: typically less than 1.0ps from 0
volt
to BV min.
Typical I
R
less than 1µA above 10V.
High Temperature soldering: 260°C/10 seconds at terminals.
UL E2230
SMC/DO-214AB
M
ECHANICAL
D
ATA
M
Case: JEDEC DO-214AB. Molded plastic over glass passivated junction.
Terminal: Solder plated, solderable per MIL-STD-750, Method 2026.
Polarity: Color band denotes cathode except Bidirectional.
Standard Packaging: 16mm tape (EIA STD RS-481)
.
Weight: 0.007 ounce, 0.21 grams.
D
EVICES
F
OR
B
IPOLAR
A
PPLICATION
D
For
Bidirectional
use CA suffix for type 1.5SMC6.8CA through type 1.5SMC550CA;
Electrical
characteristics
apply in both directions.
M
AXIMUM
R
ATINGS
A
ND
C
HARACTERISTICS
M
R
Ratings at
25°C
ambient temperature unless otherwise specified.
RATING
Peak Pulse Power Dissipation on 10/1000 s waveform.
(Note 1, Note 2, Fig. 1)
Peak Pulse Current on 10/1000 s waveform. (Note 1, Fig. 3)
Steady State Power Dissipation at T
L
=75
&
, Lead length .375”
(9.5mm). (Note 2, Fig. 5)
Peak Forward Surge Current,8.3ms Single Half Sine-Wave
Superimposed on Rated Load. (JEDEC Method) (Note
3,
Fig. 6)
Operating junction and Storage Temperature Range.
SYMBOL
P
PPM
I
PPM
P
M(AV)
I
FSM
T
J
, T
STG
VALUE
Minimum 1,500
See Table
UNIT
Watts
Amps
Watts
Amps
&
6.5
200
-65 to +150
Notes: 1. Non-repetitive current pulse, per Fig.
3
and derated above T
A
= 25
&
per
Fig.
2.
2. Mounted on 8.0mm x 8.0mm Copper Pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle = 4 pulses per minute maximum.
All specifications
subject to change without notice.
1
Rev 7
MERITEK [ MERITEK ELECTRONICS CORPORATION ]
