DLL-095R-2.14G
DELAY LINE
PRELIMINARY
REV: 006, 12/02/04
TECHNICAL DESCRIPTION
FEATURES
• 2110 - 2170 MHz
• LOW LOSS
• LOW VSWR
• SURFACE MOUNT
• LOW COST
MULTI-MIX
®
DELAY LINES
APPLICATIONS
• UMTS
• BASE STATION POWER AMPLIFIER
LINEARIZATION NETWORKS
• FEED FORWARD
• PRE-DISTORTION
• ADAPTIVE INTERFERENCE CANCELLATION
The DLL-095R-2.14G, a member of the Multi-Mix
®
DLL family of delay lines, provides a mean delay of
9.54 nS in the UMTS band and features low insertion loss and low VSWR. The DLL-095R-2.14G exhibits
excellent phase linearity and amplitude flatness over the 2110 - 2170 MHz frequency range. The Multi-
Mix
®
DLL-095R-2.14G is intended for use in power amplifier linearization networks such as feedforward
and predistortion.
DLL delay lines are fusion bonded multilayer stripline structures. The DLL series offers an excellent alter-
native to expensive coaxial and delay filter structures. The fusion bonding process yields a homgeneous
monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is
superior to conventional adhesive bonding techniques.
GENERAL SPECIFICATIONS
FREQUENCY RANGE
MHz
2110 - 2170
RETURN LOSS
(dB MIN)
20
MEAN DELAY*
(nS)
9.54 ± 0.2
INSERTION LOSS
(dB MAX)
5.8
PHASE DEVIATION
(DEGREES MAX)
± 2.0
POWER HANDLING
(WATTS)
15
RF INTERFACE
AMPLITUDE FLATNESS
(dB p-p)
0.15
SIZE/OUTLINE
(Inches - l,w,h)
1.0 x 1.0 x 0.090
Surface Mount
Specifications are based upon unit mounted on printed circuit board with 50 Ohm nominal impedance.
*Mean delay refers to the group delay of the applied input signal through the network. The specified tolerance relates to unit-unit group delay variation.
PACKAGE OUTLINE / MOUNTING CONFIGURATION
1.000 [25.40]
HOT VIA
0.087 [2.21]
HOT VIA
GND
GROUND PLANE OF UNIT SHOULD
BE SOLDERED TO GROUND PLANE
OF CIRCUIT BOARD FOR OPTIMUM
PERFORMANCE.
2X 0.848 [21.54]
1.000 [25.40]
0.848 [21.54]
3X 0.037 [0.94]
1
ORIENTATION MARKER
DENOTES PIN LOCATION
2
GND
PIN 2
0.848 [21.54]
0.076 [1.93] SQ
2X 0.069 [1.77]
4X 0.076 [1.93]
4X 0.076 [1.93]
PIN 1
50 OHM LINE
.032 DIELECTRIC THICKNESS
ER = 3.38
GROUND PLANE
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO 9001:2000 REGISTERED
U.S. Patent 6,099,677 and other Patents Pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
2X 0.848 [21.54]
0.037
TYP [0.94]
MERRIMAC [ MERRIMAC INDUSTRIES, INC. ]
