欢迎访问ic37.com |
会员登录 免费注册
发布采购

PDD-3Z-2.45G 参数 Datasheet PDF下载

PDD-3Z-2.45G图片预览
型号: PDD-3Z-2.45G
PDF下载: 下载PDF文件 查看货源
内容描述: 3 -WAY功率分配器 [3-WAY POWER DIVIDERS]
分类和应用:
文件页数/大小: 5 页 / 136 K
品牌: MERRIMAC [ MERRIMAC INDUSTRIES, INC. ]
 浏览型号PDD-3Z-2.45G的Datasheet PDF文件第2页浏览型号PDD-3Z-2.45G的Datasheet PDF文件第3页浏览型号PDD-3Z-2.45G的Datasheet PDF文件第4页浏览型号PDD-3Z-2.45G的Datasheet PDF文件第5页  
PDD-3Z-2.45G
3-WAY POWER DIVIDERS
REV: 001, 05/20/02
2.35 - 2.60 GHz
LOW LOSS
HIGH ISOLATION
SURFACE MOUNT
TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX PICO™ Z-SERIES POWER DIVIDERS
The Multi-Mix® PDD-Z series provides an in-phase, binary power divider with low insertion loss in a
small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ net-
works, power amplifiers, signal distribution and processing.
PDD-Z power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-
ance that is superior to conventional adhesive bonding techniques.
The PDD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless appli-
cations. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible
with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
Available on tape and reel
Cost effective for commercial wireless applications
Small outline size
Operating temperature range –55°C to +85°C.
Can be integrated with other Multi-Mix® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is suitable for automated
assembly.
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.6636 / Fax: 973.882.5990 / Email: pico@merrimacind.com / www.Multi-Mix.com