MIC5200
Note 1:
Micrel, Inc.
Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do
not apply when operating the device outside of its rated operating conditions. The maximum allowable power dissipation is a
function of the maximum junction temperature, T
J (MAX)
, the junction-to-ambient thermal resistance,
θ
JA
, and the ambient tem-
perature, T
A
. The maximum allowable power dissipation at any ambient temperature is calculated using: P
(MAX)
= (T
J(MAX)
– T
A
)
÷ θ
JA
. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go
into thermal shutdown. The
θ
JC
of the MIC5200-xxBS is 15°C/W and
θ
JA
for the MIC5200BM is 160°C/W mounted on a PC
board (see “Thermal Considerations” section for further details).
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regula-
tion in the load range from 0.1mA to 100mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a 100mA load pulse at V
IN
= 26V for t = 10ms.
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
April 2005
4
M9999-040805
MICREL [ MICREL SEMICONDUCTOR ]
