1.3
µ
m D2300-Type Digital
Isolated DFB Laser Module
Data Sheet
February 2000
Lucent Technologies Microelectronics Group optoelec-
tronic components are qualified to rigorous internal
standards that are consistent with
Telcordia Technolo-
gies
TR-NWT-000468. All design and manufacturing
operations are
ISO
* 9001 certified. The module is fully
qualified for central office applications.
*
ISO
is a registered trademark of The International Organization for
Standardization.
Description
The D2300-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, distributed-
feedback (DFB) laser designed for 1.3
µ
m applications.
The laser is designed to be used in OC-12/STM-4 (622
Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long-
reach and extended-reach applications.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard.
Pin Information
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Name
Thermistor
Thermistor
Laser dc Bias (cathode) (–)
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)*
Thermoelectric Cooler (–)*
Case Ground
Case Ground
Case Ground
Laser Anode
†
(+)
RF Laser Input Cathode (–)
Laser Anode
†
(+)
Case Ground
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25
°
C for case temperatures from –40
°
C to +80
°
C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the aver-
age laser output power.
* A positive current through the thermoelectric heat pump cools the
laser.
† Both leads should be grounded for optimum performance.
7
–
6
+
5
+
4
–
L1
160 nH
3
–
2
1
TH
10 kΩ
TEC
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25
Ω
impedance. The laser module is equipped with a sin-
gle-mode fiber. The pigtail has an 8
µ
m core and
125
µ
m cladding with a 900
µ
m tight buffer coating.
8
PACKAGE
GROUNDS
+
9
10
11
R1
20
Ω
–
12
ISOLATOR
+
13
14
1-567
Top view.
Figure 1. Circuit Schematic
2
Lucent Technologies Inc.
MICRO-ELECTRONICS [ Micro Electronics ]
