ML6554
60
60
40
Θ
JA (ºC/W)
20
16Ld PSOP2
2.3x3.1mm PAD
1.9mm DIE
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
POWER (W)
NATURAL CONVECTION
Θ
JA TEST RESULTS
1.27mm PITCH PowerSOP™ 2
SLUG SOLDERED
θ
JA (ºC/W)
40
20
16Ld PSOP2
2.3x3.1mm PAD
1.9mm DIE @ 0.8 WATTS
0
0
100
200
300
400
500
AIR VELOCITY (LFPM)
FORCED CONVECTION
Θ
JA TEST RESULTS
1.27mm PITCH PowerSOP™ 2
SLUG SOLDERED
Figure 10. Graphical Results Summary – 1S2P Test Board
DRAWING NUMBER
Applicable Jedec Spec
Substrate Material
Dimensions (LxW) (Overall)
Dimensions (LxW) (Metallization)
Dimensions (LxW) (Inner Planes)
Thickness
Pitch
Stackup (# Signal Layers, # Cu Planes)
Cu Trace Coverage (Signal Layer)
Cu Coverage (Internal Layer)
Trace Width (Spec/Measured)
Trace Cu Thickness (Spec/Measured)
Inner Cu Thickness (Spec/Measured)
Build #
ENG-CB-1007 REV A
JC 51-X (Note 1)
(Sroposed Spec)
FR-4
114.3 x 76.2mm
55 x 65mm
73 x 73mm
1.6 mm
1.27mm
1S2P
12%
100%
235.5±25.5/288µm
70±14/67µm
35±3.5/31µm
C1797
Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".
Figure 11. Test Board Layout for
Q
JA
vs. Airflow
NOVEMBER, 1999
11
MICRO-LINEAR [ MICRO LINEAR CORPORATION ]
