TC4426A/TC4427A/TC4428A
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
α
A
c
φ
A1
(F)
β
A2
L
MIN
MAX
Number of Pins
Pitch
-
A
.043
Overall Height
A2
.030
.037
Molded Package Thickness
.000
.006
A1
Standoff
E
Overall Width
E1
Molded Package Width
D
Overall Length
L
.016
.031
Foot Length
Footprint (Reference)
F
φ
Foot Angle
0°
8°
c
Lead Thickness
.003
.009
.009
.016
Lead Width
B
α
Mold Draft Angle Top
5°
15°
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Units
Dimension Limits
n
p
INCHES
NOM
8
.026 BSC
-
.033
-
.193 TYP.
.118 BSC
.118 BSC
.024
.037 REF
-
.006
.012
-
-
MILLIMETERS*
MIN
NOM
8
0.65 BSC
-
-
0.75
0.85
0.00
-
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
-
0°
0.08
-
0.22
-
5°
-
5°
-
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21423F-page 12
©
2006 Microchip Technology Inc.