Micron M25P40 Serial Flash Embedded Memory
Package Information
Figure 31: UFDFPN8 (MLP8) 4mm x 3mm
Datum A
4.00 ±0.10
A
B
1
2
3
0.80 ±0.10
4
8 x (0.60 ±0.05)
Datum B
0.20 ±0.10
0.20 DIA TYP
3.00 ±0.10
(See note 1)
2X
2X
0.10
C
1
2
Top View
-0.10
0.55
+0.05
C
0.02 -0.02
+0.03
Side View
C
See detail A
8 x (0.30 ±0.05)
8
7
6
5
0.10
0.05
M C A B
M C
0.10
0.80 TYP
Bottom View
Datum A or B
// 0.10
0.05
C
C
0.127 MIN/
0.15 MAX
0.60 ±0.05
0.80 TYP
Terminal Tip
0.40 TYP
Even Terminal/Side
Detail A
Seating Plane
Notes:
1. The dimension 0.30 ±0.05 applies to the metallic terminal and is measured between
0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimensions should not be measured in that radius
area.
2. Maximum package warping is 0.05mm; maximum allowable burrs is 0.076mm in all di-
rections; the bilateral coplanarity zone applies to the exposed heat sink slug as well as
to the terminals.
3. Drawing is not to scale.
PDF: 09005aef8456654f
m25p40.pdf - Rev. Y 8/12 EN
52
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