Micron Confidential and Proprietary
Advance
‡
32Gb, 64Gb, 128Gb Asynchronous/Synchronous NAND
Features
NAND Flash Memory
MT29F32G08CBACA, MT29F64G08CEACA, MT29F64G08CFACA,
MT29F128G08CXACA, MT29F64G08CECCB
Features
•
Open NAND Flash Interface (ONFI) 2.2-compliant
1
•
Multiple-level cell (MLC) technology
•
Organization
–
Page size x8: 4320 bytes (4096 + 224 bytes)
–
Block size: 256 pages (1024K + 56K bytes)
–
Plane size: 2 planes x 2048 blocks per plane
–
Device size: 32Gb: 4096 blocks;
64Gb: 8192 blocks;
128Gb: 16,384 blocks
•
Synchronous I/O performance
–
Up to synchronous timing mode 5
–
Clock rate: 10ns (DDR)
–
Read/write throughput per pin: 200 MT/s
•
Asynchronous I/O performance
–
Up to asynchronous timing mode 5
–
t
RC/
t
WC: 20ns (MIN)
•
Array performance
–
Read page: 50µs (MAX)
–
Program page: 1300µs (TYP)
–
Erase block: 3ms (TYP)
•
Operating Voltage Range
–
V
CC
: 2.7–3.6V
–
V
CCQ
: 1.7–1.95V, 2.7–3.6V
•
Command set: ONFI NAND Flash Protocol
•
Advanced Command Set
–
Program cache
–
Read cache sequential
–
Read cache random
–
One-time programmable (OTP) mode
–
Multi-plane commands
–
Multi-LUN operations
–
Read unique ID
–
Copyback
•
First block (block address 00h) is valid when ship-
ped from factory. For minimum required ECC, see
•
RESET (FFh) required as first command after power-
on
•
Operation status byte provides software method for
detecting
–
Operation completion
–
Pass/fail condition
–
Write-protect status
•
Data strobe (DQS) signals provide a hardware meth-
od for synchronizing data DQ in the synchronous
interface
•
Copyback operations supported within the plane
from which data is read
•
Quality and reliability
–
Data retention: 10 years
–
Endurance: 3000 PROGRAM/ERASE cycles
•
Operating temperature:
–
Commercial: 0°C to +70°C
–
Industrial (IT): –40ºC to +85ºC
•
Package
–
52-pad LGA
–
48-pin TSOP
–
100-ball BGA
Note:
1. The ONFI 2.2 specification is available at
PDF: 09005aef83f64350
l73a_32g_64g_128g_asyncsync_nand.pdf – Rev. A 3/10 EN
1
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2010 Micron Technology, Inc. All rights reserved.
Draft 03/25/10