Micron Confidential and Proprietary
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
Signal Assignments
2. See Asynchronous Interface Bus Operation for detailed asynchronous interface signal
descriptions.
Signal Assignments
Figure 2: 48-Pin TSOP – Type 1 (Top View)
x16
x8
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
x8
V
SS
1
DNU
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
V
CC
1
DNU
2
V
CC
V
SS
NC
V
CC
1
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
DNU
V
SS
1
x16
V
SS
I/O15
I/O14
I/O13
I/O7
I/O6
I/O5
I/O4
I/O12
V
CC
DNU
2
V
CC
V
SS
NC
V
CC
I/O11
I/O3
I/O2
I/O1
I/O0
I/O10
I/O9
I/O8
V
SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
R/B#2
3
R/B2#
3
R/B#
R/B#
RE#
RE#
CE#
CE#
3
CE2#
3
CE2#
NC
NC
V
CC
V
CC
V
SS
V
SS
NC
NC
NC
NC
CLE
CLE
ALE
ALE
WE# WE#
WP# WP#
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Notes:
1. These pins might not be bonded in the package; however, Micron recommends that the
customer connect these pins to the designated external sources for ONFI compatibility.
2. For the 3V device, pin 38 is DNU. For the 1.8V device, pin 38 is LOCK.
3. R/B2# and CE2# are available on 16Gb devices only. They are NC for other configura-
tions.
PDF: 09005aef83b25735
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
