512Mb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS-compliant
Supports JEDEC clock jitter specification
Options
1
• Configuration
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Rev. F, G
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 4 (DDR2-667)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
• Self refresh
– Standard
– Low-power
• Operating temperature
– Commercial (0°C
≤
T
C
≤
+85°C)
– Industrial (–40°C
≤
T
C
≤
+95°C;
–40°C
≤
T
A
≤
+85°C)
– Automotive (–40°C
≤
T
C
, T
A
≤
+105°C)
• Revision
Note:
Marking
128M4
64M8
32M16
HR
CF
HW
JN
-187E
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:F/:G
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
MICRON [ MICRON TECHNOLOGY ]
