512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Electrical Specifications
Table 15:
I
DD
7 Specifications and Conditions (x16 and x32)
Notes:1–6, 8, 11, 13, 15, 27; notes appear on pages 51–52; V
DD
/V
DD
Q = 1.70–1.95V
Parameter/Condition
Self refresh
CKE = LOW;
t
CK =
t
CK (MIN);
Address and control inputs are stable;
Data bus inputs are stable.
Full array, 85°C
Full array, 70°C
Full array, 45°C
Full array, 15°C
Half array, 85°C
Half array, 70°C
Half array, 45°C
Half array, 15°C
1/4 array, 85°C
1/4 array, 70°C
1/4 array, 45°C
1/4 array, 15°C
1/8 array, 85°C
1/8 array, 70°C
1/8 array, 45°C
1/8 array, 15°C
1/16 array, 85°C
1/16 array, 70°C
1/16 array, 45°C
1/16 array, 15°C
Symbol
Low I
DD
7
Option “L”
300
230
180
160
250
200
170
150
210
175
155
140
180
155
145
135
170
145
135
130
Standard I
DD
7
Option
500
430
380
360
440
380
350
330
410
365
335
305
390
350
315
300
380
340
320
290
Units
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
Notes
I
DD
7a
I
DD
7b
I
DD
7c
I
DD
7d
I
DD
7a
I
DD
7b
I
DD
7c
I
DD
7d
I
DD
7a
I
DD
7b
I
DD
7c
I
DD
7d
I
DD
7a
I
DD
7b
I
DD
7c
I
DD
7d
I
DD
7a
I
DD
7b
I
DD
7c
I
DD
7d
Figure 35:
Typical Self Refresh Current vs. Temperature
250
Full array
Half array
1/4 array
1/8 array
1/16 array
200
Current
(µA)
150
100
50
0
-40
-30
-20
-10
0
10
20
30
40
Temperature (°C)
50
60
70
80
90
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
50
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.