128Mb: x4, x8, x16
SDRAM
128Mb SDRAM PART NUMBERS
PART NUMBER
MT48LC32M4A2TG
MT48LC32M4A2FC*
MT48LC32M4A2FB*
MT48LC16M8A2TG
MT48LC16M8A2FC*
MT48LC16M8A2FB*
MT48LC8M16A2TG
ARCHITECTURE
32 Meg x 4
32 Meg x 4
32 Meg x 4
16 Meg x 8
16 Meg x 8
16 Meg x 8
8 Meg x 16
*See page 59 for FBGA Device Marking Table.
GENERAL DESCRIPTION
The Micron
®
128Mb SDRAM is a high-speed CMOS,
dynamic random-access memory containing 134,217,728
bits. It is internally configured as a quad-bank DRAM
with a synchronous interface (all signals are registered on
the positive edge of the clock signal, CLK). Each of the x4’s
33,554,432-bit banks is organized as 4,096 rows by 2,048
columns by 4 bits. Each of the x8’s 33,554,432-bit banks is
organized as 4,096 rows by 1,024 columns by 8 bits. Each
of the x16’s 33,554,432-bit banks is organized as 4,096
rows by 512 columns by 16 bits.
Read and write accesses to the SDRAM are burst ori-
ented; accesses start at a selected location and continue
for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an AC-
TIVE command, which is then followed by a READ or
WRITE command. The address bits registered coinci-
dent with the ACTIVE command are used to select the
bank and row to be accessed (BA0, BA1 select the bank;
A0-A11 select the row). The address bits registered
coincident with the READ or WRITE command are used
to select the starting column location for the burst
access.
The SDRAM provides for programmable READ
or WRITE burst lengths of 1, 2, 4, or 8 locations, or the
full page, with a burst terminate option. An auto
precharge function may be enabled to provide a self-
timed row precharge that is initiated at the end of the
burst sequence.
The 128Mb SDRAM uses an internal pipelined
architecture to achieve high-speed operation. This
architecture is compatible with the 2n rule of prefetch
architectures, but it also allows the column address to be
changed on every clock cycle to achieve a high-speed,
fully random access. Precharging one bank while access-
ing one of the other three banks will hide the precharge
cycles and provide seamless high-speed, random-access
operation.
The 128Mb SDRAM is designed to operate in 3.3V
memory systems. An auto refresh mode is provided, along
with a power-saving, power-down mode. All inputs and
outputs are LVTTL-compatible.
SDRAMs offer substantial advances in DRAM operat-
ing performance, including the ability to synchronously
burst data at a high data rate with automatic column-
address generation, the ability to interleave between in-
ternal banks in order to hide precharge time and the
capability to randomly change column addresses on each
clock cycle during a burst access.
128Mb: x4, x8, x16 SDRAM
128MSDRAM_E.p65 – Rev. E; Pub. 1/02
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
MICRON [ MICRON TECHNOLOGY ]
