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MT4LC16M4A7DJ-5 参数 Datasheet PDF下载

MT4LC16M4A7DJ-5图片预览
型号: MT4LC16M4A7DJ-5
PDF下载: 下载PDF文件 查看货源
内容描述: DRAM [DRAM]
分类和应用: 内存集成电路光电二极管动态存储器
文件页数/大小: 20 页 / 350 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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16 MEG x 4
FPM DRAM
DRAM
FEATURES
• Single +3.3V ±0.3V power supply
• Industry-standard x4 pinout, timing, functions,
and packages
• 13 row, 11 column addresses (A7)
12 row, 12 column addresses (T8)
• High-performance CMOS silicon-gate process
• All inputs, outputs and clocks are LVTTL-compat-
ible
• FAST-PAGE-MODE (FPM) access
• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH
distributed across 64ms
• Optional self refresh (S) for low-power data
retention
MT4LC16M4A7, MT4LC16M4T8
PIN ASSIGNMENT (Top View)
32-Pin SOJ
V
CC
DQ0
DQ1
NC
NC
NC
NC
WE#
RAS#
A0
A1
A2
A3
A4
A5
V
CC
32-Pin TSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
SS
DQ3
DQ2
NC
NC
NC
CAS#
OE#
A12/NC**
A11
A10
A9
A8
A7
A6
V
SS
OPTIONS
• Refresh Addressing
4,096 (4K) rows
8,192 (8K) rows
• Plastic Packages
32-pin SOJ (400 mil)
32-pin TSOP (400 mil)
• Timing
50ns access
60ns access
• Refresh Rates
Standard Refresh
Self Refresh (128ms period)
MARKING
T8
A7
DJ
TG
-5
-6
None
S*
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
V
SS
DQ0
DQ3
DQ1
DQ2
NC
NC
NC
NC
NC
NC
NC
WE#
CAS#
RAS#
OE#
A0
A12/NC**
A1
A11
A2
A10
A3
A9
A4
A5
A8
V
CC
A7
A6
V
SS
**A12 on A7 version and NC on T8 version
16 MEG x 4 FPM DRAM PART NUMBERS
PART NUMBER
MT4LC16M4A7DJ-x
MT4LC16M4A7DJ-x S
MT4LC16M4A7TG-x
MT4LC16M4A7TG-x S
MT4LC16M4T8DJ-x
MT4LC16M4T8DJ-x S
MT4LC16M4T8TG-x
MT4LC16M4T8TG-x S
x = speed
REFRESH
ADDRESSING PACKAGE REFRESH
8K
8K
8K
8K
4K
4K
4K
4K
SOJ
SOJ
TSOP
TSOP
SOJ
SOJ
TSOP
TSOP
Standard
Self
Standard
Self
Standard
Self
Standard
Self
NOTE:
1. The 16 Meg x 4 FPM DRAM base number
differentiates the offerings in one place—
MT4LC16M4A7. The fifth field distinguishes
various options: A7 designates an 8K refresh and
T8 designates a 4K refresh for FPM DRAMs.
2. The # symbol indicates signal is active LOW.
*Contact factory for availability
Part Number Example:
GENERAL DESCRIPTION
The 16 Meg x 4 DRAMs are high-speed CMOS,
dynamic random-access memory devices contain-ing
67,108,864 bits organized in a x4 configuration. The
MT4LC16M4A7 and MT4LC16M4T8 are functionally
organized as 16,777,216 locations containing four bits
each. The 16,777,216 memory locations are arranged in
8,192 rows by 2,048 columns for the MT4LC16M4A7 or
4,096 rows by 4,096 columns for the MT4LC16M4T8.
During READ or WRITE cycles, each location is uniquely
MT4LC16M4A7DJ
KEY TIMING PARAMETERS
SPEED
-5
-6
t
RC
t
RAC
t
PC
t
AA
t
CAC
90ns
110ns
50ns
60ns
30ns
35ns
25ns
30ns
13ns
15ns
16 Meg x 4 FPM DRAM
D21_2.p65 – Rev. 5/00
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2000, Micron Technology, Inc.