Micron Confidential and Proprietary
4GB, 8GB, 16GB, 32GB, 64GB: e·MMC
Package Dimensions
Figure 8: 169-Ball LFBGA – 14.0mm x 18.00mm x 1.4mm (Package Code: DN)
Seating plane
A
0.08 A
169X Ø0.3
Dimensions apply
to solder balls post-
reflow on Ø0.30 SMD
ball pads.
Ball A1 ID
(covered by SR)
14 12 10 8 6 4 2
13 11 9 7 5 3 1
Ball A1 ID
13.5 CTR
6.5 CTR
18 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
0.5 TYP
0.5 TYP
6.5 CTR
14 ±0.1
1.3 ±0.1
0.16 MIN
Note:
1. Dimensions are in millimeters.
PDF: 09005aef84a4d6f8
emmc_4gb_8gb_16gb_32gb_64gb-it.pdf - Rev. D 07/12 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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