DATA SHEET
HAL 2xy
Symbol
Parameter
Pin No.
Min.
Typ.
Max.
Unit
Conditions
SOT89B Package
Thermal Resistance
R
thja
R
thjc
Junction to Ambient
Junction to Case
−
−
−
−
−
−
212
73
K/W
K/W
Measured with a 1s0p board
30 mm x 10 mm x 1.5 mm,
pad size (see Fig. 3–3)
TO92UA Package
Thermal Resistance
R
thja
R
thjc
1)
Measured with a 1s0p board
−
−
−
−
−
−
225
63
K/W
K/W
Junction to Ambient
Junction to Case
V
DD
= 12 V, B > B
ON
+ 2 mT or B < B
OFF
−
2 mT and B > B
OFF
+ 2 mT or B < B
ON
- 2 mT for HAL 212
1.80
1.05
1.45
2.90
1.05
0.50
1.50
Fig. 3–3:
Recommended footprint SOT89B-3,
Dimensions in mm
All dimensions are for reference only. The pad size may
vary depending on the requirements of the soldering
process.
Micronas
Jan. 11, 2010; DSH000141_003EN
11
MICRONAS [ MICRONAS ]
