DATA SHEET
HAL810
1.6. Solderability and Welding
Soldering
During soldering, reflow processing and manual
reworking, a component body temperature of 260 °C
should not be exceeded.
Welding
Device terminals should be compatible with laser and
resistance welding. Please note that the success of
the welding process is subject to different welding
parameters which will vary according to the welding
technique used. A very close control of the welding
parameters is absolutely necessary in order to reach
satisfying results. Micronas, therefore, does not give
any implied or express warranty as to the ability to
weld the component.
1.3. Marking Code
The HAL810 has a marking on the package surface
(branded side). This marking includes the name of the
sensor and the temperature range.
Type
A
HAL810
810A
Temperature Range
K
810K
1.4. Operating Junction Temperature Range (T
J
)
The Hall sensors from Micronas are specified to the
chip temperature (junction temperature T
J
).
A:T
J =
−40
°C to +170 °C
K:T
J =
−40
°C to +140 °C
The relationship between ambient temperature (T
A
)
and junction temperature is explained in Section 4.5.
1.7. Pin Connections and Short Descriptions
Pin
No.
1
Pin Name
VDD
GND
OUT
OUT
Type
IN
Short Description
Supply Voltage and
Programming Pin
Ground
Push-Pull Output
1.5. Hall Sensor Package Codes
HALXXXPA-T
Temperature Range: A or K
Package: UT for TO92UT-1/-2
Type: 810
Example:
HAL810UT-K
→
Type:
810
→
Package:
TO92UT
→
Temperature Range: T
J
=
−40
°C to +140 °C
Hall sensors are available in a wide variety of packag-
ing versions and quantities. For more detailed informa-
tion, please refer to the brochure: “Hall Sensors:
Ordering Codes, Packaging, Handling”.
2
GND
OUT
3
2
3
1
V
DD
Fig. 1–1:
Pin configuration
Micronas
Feb. 6, 2009; DSH000034_003EN
5
MICRONAS [ MICRONAS ]
