PRODUCT DATABOOK 1996/1997
SG1842/SG1843 Series
C
URRENT
-M
ODE
PWM C
ONTROLLER
P
R O D U C T I O N
D
A T A
S
H E E T
A B S O L U T E M A X I M U M R AT I N G S
(Notes 1 & 2)
PACKAGE PIN OUTS
COMP
V
FB
I
SENSE
R
T
/C
T
1
2
3
4
8
7
6
5
Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)........ 260°C (+0, -5)
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
Supply Voltage (I
CC
< 30mA) ............................................................... Self Limiting
Supply Voltage (Low Impedance Source) ........................................................ 30V
Output Current (Peak) ....................................................................................... ±1A
Output Current (Continuous) ....................................................................... 350mA
Output Energy (Capacitive Load) ....................................................................... 5µJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current ..................................................................... 10mA
Power Dissipation at T
A
= 25°C (DIL-8) ............................................................ 1W
Operating Junction Temperature
Hermetic (J, Y, F, L Packages) ................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
Storage Temperature Range .......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C
V
REF
V
CC
OUTPUT
GND
M & Y PACKAGE
(Top View)
M Package: Pb-free / RoHS 100% Matte Tin Lead Finish
COMP
V
FB
I
SENSE
R
T
/C
T
1
2
3
4
8
7
6
5
V
REF
V
CC
OUTPUT
GND
DM PACKAGE
(Top View)
Pb-free / RoHS
100% Matte Tin Lead Finish
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
1
2
3
4
5
6
7
14
13
12
11
10
9
8
T H E R M A L D ATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
J PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
F PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
L PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
35°C/W
120°C/W
3
2
V
REF
N.C.
V
CC
V
C
OUTPUT
GND
PWR GND
95°C/W
65°C/W
165°C/W
120°C/W
130°C/W
80°C/W
80°C/W
145°C/W
D PACKAGE
(Top View)
Pb-free / RoHS 100% Matte Tin Lead Finish
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
REF
N.C.
V
CC
V
C
OUTPUT
GROUND
POWER GND
J & N PACKAGE
(Top View)
N Package: Pb-free / RoHS 100% Matte Tin Lead Finish
1. COMP
2. V
FB
3. I
SENSE
4. R
T
/C
T
5. POWER GND
1
2
3
4
5
10
9
8
7
6
10.V
REF
9. V
CC
8. V
C
7. OUTPUT
6. GND
F PACKAGE
(Top View)
1 20 19
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
4
5
6
7
8
18
17
16
15
14
9 10 11 12 13
1. N.C.
2. COMP
3. N.C.
4. N.C.
5. V
FB
6. N.C.
7. I
SENSE
8. N.C.
9. N.C.
10. R
T
/C
T
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
N.C.
GROUND
N.C.
N.C.
OUTPUT
N.C.
V
CC
N.C.
N.C.
V
REF
L PACKAGE
(Top View)
2
Copyright © 2000
Rev. 1.6a
10/04
MICROSEMI [ MICROSEMI CORPORATION ]
