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3N190_TO-78 参数 Datasheet PDF下载

3N190_TO-78图片预览
型号: 3N190_TO-78
PDF下载: 下载PDF文件 查看货源
内容描述: 单片双增强型P沟道MOSFET [a monolithic dual enhancement mode P-Channel Mosfet]
分类和应用:
文件页数/大小: 1 页 / 290 K
品牌: MICROSS [ MICROSS COMPONENTS ]
   
3N190
P-CHANNEL MOSFET
The 3N190 is a monolithic dual enhancement mode P-Channel Mosfet
FEATURES 
DIRECT REPLACEMENT FOR INTERSIL 3N190 
LOW GATE LEAKAGE CURRENT 
I
GSS 
≤ ± 10pA 
LOW TRANSFER CAPACITANCE 
C
rss 
≤ 1.0pF 
1
The hermetically sealed TO-78 package is well suited
ABSOLUTE MAXIMUM RATINGS
@ 25°C (unless otherwise noted) 
for high reliability and harsh environment applications.
Maximum Temperatures 
Storage Temperature 
‐65°C to +150°C 
(See Packaging Information).
Operating Junction Temperature 
‐55°C to +135°C 
Maximum Power Dissipation 
Continuous Power Dissipation (one side) 
300mW 
3N190 Features:
Continuous Power Dissipation (one side)
525mW 
MAXIMUM CURRENT
Very high Input Impedance
Drain to Source
2
 
50mA 
High Gate Breakdown Voltage
MAXIMUM VOLTAGES 
Low Capacitance
Drain to Gate or Drain to Source
2
 
‐30V 
2,3
Transient Gate to Source
±125V 
Gate‐Gate Voltage 
±80V 
3N190 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL 
CHARACTERISTIC 
MIN 
TYP. 
MAX 
UNITS 
CONDITIONS 
BV
DSS
 
Drain to Source Breakdown Voltage 
‐40 
‐‐ 
‐‐ 
 
I
= ‐10µA 
 
BV
SDS
 
Source to Drain Breakdown Voltage 
‐40 
‐‐ 
‐‐ 
I
= ‐10µA,   V
BD
 = 0V 
V
GS
 
Gate to Source Voltage 
‐3.0 
‐‐ 
‐6.5 
V
DS
 = ‐15V,   I
= ‐500µA 
V
GS(th)
 
Gate to Source Threshold Voltage 
‐2.0 
‐‐ 
‐5.0 
V
DS
 = ‐15V,   I
= ‐500µA 
‐2.0 
‐‐ 
‐5.0 
V
DS
 =  V
GS
 ,   I
= ‐10µA 
I
GSSR
 
Gate Reverse Leakage Current 
‐‐ 
‐‐ 
10 
 
V
GS 
= 40V 
I
GSSF
 
I
DSS
 
I
SDS
 
I
D(on)
 
r
DS(on)
 
g
fs
 
The 3N190 is a dual enhancement mode P-Channel
Mosfet and is ideal for space constrained applications
and those requiring tight electrical matching.
Y
os
 
C
iss
 
 Input Capacitance 
‐‐ 
‐‐ 
4.5 
 
 
pF 
V
DS
 = ‐15V,    I
= ‐5mA ,   f = 1MHz 
C
rss
 
Reverse Transfer Capacitance 
‐‐ 
‐‐ 
1.0 
C
oss
 
Output Capacitance 
‐‐ 
‐‐ 
3.0 
MATCHING CHARACTERISTICS 3N190                                                                                                                                      
SYMBOL 
LIMITS 
 
 
CHARACTERISTIC 
UNITS 
CONDITIONS 
MIN 
MAX 
g
fs1
/g
fs2 
 
Forward Transconductance Ratio 
0.85 
1.0 
ns 
V
DS
 = ‐15V,    I
= ‐500µA ,   f = kHz 
V
GS1‐2
 
Gate Source Threshold Voltage 
‐‐ 
100 
mV 
V
DS
 = ‐15V,    I
= ‐500µA 
5
Differential
 
 
 
 
V
DS
 = ‐15V,    I
= ‐500µA, T
= ‐55°C to +25°C 
∆V
GS1‐2
/∆T 
Gate Source Threshold Voltage 
5
‐‐ 
100 
µV/°C 
Differential Change with Temperature
 
V
DS
 = ‐15V,    I
= ‐500µA, T
= +25°C to +125°C 
SWITCHING CHARACTERISTICS   
SYMBOL 
CHARACTERISTIC 
t
d(on)
 
Turn On Delay Time 
t
r
 
Turn On Rise Time 
t
off
 
Turn Off Time 
MIN 
‐‐ 
‐‐ 
‐‐ 
TYP 
‐‐ 
‐‐ 
‐‐ 
MAX 
15 
30 
50 
UNITS 
 
ns 
CONDITIONS 
 
V
DD
 = ‐15V, I
D(on)
 = ‐5mA, R
= R
= 1.4KΩ 
Note 1 ‐ Absolute maximum ratings are limiting values above which 3N190 serviceability may be impaired. 
Note 2 – Per Transistor 
Note 3 – Approximately doubles for every 10
°C in T
A
 
Device Schematic
Note 4 – Measured at end points, 
T
and T
Note 5 – Pulse: t= 300µS, Duty Cycle ≤ 3%
 
TO-78 (Bottom View)
Available Packages:
3N190 in TO-72
3N190 in bare die.
Tel: +44 1603 788967
Email:
chipcomponents@micross.com
Web:
http://www.micross.com/distribution
Please contact Micross for full
package and die dimensions
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.