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SSTDPAD100 参数 Datasheet PDF下载

SSTDPAD100图片预览
型号: SSTDPAD100
PDF下载: 下载PDF文件 查看货源
内容描述: 线性系统替换停产Siliconix公司SSTDPAD100 [Linear Systems replaces discontinued Siliconix SSTDPAD100]
分类和应用: 二极管光电二极管
文件页数/大小: 1 页 / 274 K
品牌: MICROSS [ MICROSS COMPONENTS ]
   
SSTDPAD100
LOW LEAKAGE
PICO-AMP DUAL DIODE
Linear Systems replaces discontinued Siliconix SSTDPAD100
The SSTDPAD100 is a low leakage Monolithic Dual Pico-Amp Diode
The SSTDPAD100 low-leakage monolithic dual diode
provides a superior alternative to conventional diode
technology when reverse current (leakage) must be
minimized. In addition the monolithic dual construction
allows excellent capacitance matching per diode. The
SSTDPAD100 features a leakage current of -100 pA
and is well suited for use in applications such as input
protection for operational amplifiers.
FEATURES 
DIRECT REPLACEMENT FOR SILICONIX SSTDPAD100 
HIGH ON ISOLATION 
EXCELLENT CAPACITANCE MATCHING 
ULTRALOW LEAKAGE 
REVERSE BREAKDOWN VOLTAGE 
REVERSE CAPACITANCE 
ABSOLUTE MAXIMUM RATINGS  
@ 25°C (unless otherwise noted) 
Maximum Temperatures 
Storage Temperature 
Operating Junction Temperature 
Maximum Power Dissipation 
Continuous Power Dissipation  
MAXIMUM CURRENT
Forward Current (Note 1) 
20fA 
∆C
R
≤ 0.5pF 
≤ 100 pA 
BV
R
≥ ‐30V 
C
rss
 ≤ 4.0pF 
SSTDPAD100 Benefits:
Negligible Circuit Leakage Contribution
Circuit “Transparent” Except to Shunt
High-Frequency Spikes
Simplicity of Operation
‐65°C to +150°C 
‐55°C to +135°C 
500mW 
50mA 
SSTDPAD100 Applications:
 
SSTDPAD100 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL 
BV
R
 
V
F
 
C
rSS
 
Total Reverse Capacitance 
‐‐ 
‐‐ 
4.0 
|C
R1
‐C
R2
Differential Capacitance (∆C
R
‐‐ 
‐‐ 
0.5 
I
R
 
Maximum Reverse Leakage Current 
‐‐ 
‐‐ 
‐100 
pF 
pF 
pA 
SOIC (Top View)
V
= ‐5V, f = 1MHz 
V
R1 
=  V
R2 
= ‐5V, f = 1MHz 
V
= ‐ 20V 
Notes:
1. Absolute maximum ratings are limiting values above which SSTDPAD100 serviceability may be impaired.
Available Packages:
SSTDPAD100 in SOIC
SSTDPAD100 available as bare die
Please contact Micross for full package and die dimensions
Micross Components Europe
Tel: +44 1603 788967
Email:
chipcomponents@micross.com
Web:
http://www.micross.com/distribution.com
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email:
baredie@micross.com
Web:
www.micross.com/distribution.aspx