GENERAL PURPOSE (NPN) TRANSISTOR
SURFACE MOUNT PACKAGE
(2N2369AUB)
61113
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
•
•
•
Hermetically sealed
Hermetically sealed 3 pin LCC
MIL-PRF-19500 screening available
Applications:
•
•
•
•
Analog Switches
Signal Conditioning
Small Signal Amplifiers
High Density Packaging
DESCRIPTION
The
61113
is a N-P-N, general-purpose switching and amplifier transistor in a 3 pin leadless chip carrier package. All
packages are hermetically sealed for high reliability and harsh environments. This device is available custom binned to
customer specifications in commercial or screened to MIL-PRF-19500 up to JANS level.
ABSOLUTE MAXIMUM RATINGS
Collector-Base Voltage - V
CBO
................................................................................................................................................. 40Vdc
Collector-Emitter Voltage - V
CEO
.............................................................................................................................................. 15Vdc
Collector-Emitter Voltage - V
CES
.............................................................................................................................................. 40Vdc
Emitter-Base Voltage - V
EBO
................................................................................................................................................... 4.5Vdc
Collector Current – I
C(Peak)
....................................................................................................................................................... 500mA
Continuous Collector Current ................................................................................................................................................ 200mA
Maximum Junction Temperature........................................................................................................................................... +200°C
Operating Temperature (See part selection guide for actual operating temperature)............................................ -65°C to +125°C
Storage Temperature............................................................................................................................................... -65°C to +200°C
Lead Soldering Temperature (vapor phase reflow for 30 seconds) .......................................................................................215°C
Package Dimensions
Schematic Diagram
ORIENTATION KEY
0.054[1.37]
0.046 [1.17]
3
3 PLACES
0.036 [0.91]
0.024 [0.61]
C 3
0.105 [2.67]
0.085 [2.16]
2
0.125 [3.18]
0.115 [2.92]
1
0.024 [0.61]
0.016 [0.41]
E
2
B 1
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION
•
725 E. Walnut St., Garland, TX 75040
•
(972) 272-3571
•
Fax (972) 487-6918
www.micropac.com
E-MAIL: optosales@micropac.com
8 - 14
MII [ Micropac Industries ]
