SINGLE CHANNEL OPTOCOUPLER
66156
PHOTODIODE OUTPUT
COAXIAL OR BULKHEAD MOUNT PACKAGES
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
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High Reliability
Bulkhead or Press fit version
Rugged package
Stabile over wide temperature
+1.0kIV electrical isolation
Applications:
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Analog isolation
Secure telecom
Line receiver
Medical
Monitor motor control voltage
DESCRIPTION
The
66156
contains a Gallium Aluminum Arsenide (GaAIAs) infrared LED optically coupled to a silicon photodiode. This
66156-20X is a hermetically sealed package which is threaded in order to provide convenient bulkhead mounting and is
available in standard and screened versions or tested to customer specifications. The 66156-10X is a hermetically sealed
coaxial package which can be soldered or press-fit mounted and is also available in the same versions.
ABSOLUTE MAXIMUM RATINGS
Input to Output Voltage........................................................................................................................................................ 1.0kV
Reverse LED Input Voltage ...................................................................................................................................................... 3V
Peak Forward Input Current
≤
1mS (LED, continuous) ....................................................................................................100mA
Continuous Transistor Power Dissipation at (or below) 25ºC Free-Air Temperature (see Note 2) ................................300mW
Average Forward Input Current ..........................................................................................................................................50mA
Reverse Current (LED) .......................................................................................................................................................100
µ
A
Reverse Voltage (Detector, 1 min. max) ................................................................................................................................ 40V
Total Output Power Dissipation ........................................................................................................................................100mW
Storage Temperature..........................................................................................................................................-65°C to +150°C
Operating Free-Air Temperature Range ..............................................................................................................-40°C to +85°C
Lead Solder Temperature (10 seconds max.) ................................................................................................................... 260°C
Notes:
1. Derate linearly to 125°C free-air temperature at the rate of 0.68 mA/°C above 65°C.
2. Derate linearly to 125°C free-air temperature at the rate of 3 mW/°C.
Package Dimensions
Schematic Diagram
CASE GND
RED DOT
PHOTODIODE
A
K
CATHODE
ANODE
ANODE
WHITE DOT
CATHODE
K
A
MICROPAC INDUSTRIES, INC. OPTOELECTRONIC PRODUCTS DIVISION
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725 E. Walnut St., Garland, TX 75040
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(972) 272-3571
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Fax (972) 487-6918
www.micropac.com
E-MAIL:
optosales@micropac.com
3 - 42
MII [ Micropac Industries ]
