INTERCONNECTS
.050” Grid Headers and Sockets
Single and Double Row
(Number of Pins
X .050”) + .015”
Series 850, 851
852, 853
•
Series 850 single and double row
interconnects have .050” pin spacing &
permit board stacking as low as .248”.
•
Pin headers have .016” dia. pins ( MM
#4006-0 ). See page 175 for details.
•
MM #0467 and MM #4890 receptacles
use Hi-Rel, 3-finger BeCu #11 contacts
rated at 3 amps. ( #11 contact accepts
pin diameters from .015”-.020” ). See
pages 129 and 131 for details.
•
Insulators are high temp. thermoplastic,
suitable for all soldering operations.
2002/95/EC
Fig. 1
(Number of Pins
X .050”/2) + .015”
RoHS
Ordering Information
Single Row
.087” Profile Pin Header
850-XX-0_ _-10-001000
Specify # of pins
Fig. 2
(Number of Pins
X .050”) + .015”
Fig. 1
01-50
.075” Profile Pin Header
Double Row
Fig. 2
852-XX-_ _ _-10-001000
Specify # of pins
002-100
For RoHS compliance
select
plating code.
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
XX=Plating Code
See Below
SPECIFY PLATING CODE XX=
10
10μ” Au
90
200μ” Sn/Pb
40
200μ” Sn
Fig. 3
(Number of Pins
X .050”/2) + .015”
Pin Plating
Single Row
.161” Profile Socket
851-XX-0_ _-10-001000
01-50
.161” Profile Socket
002-100
.185” Profile Socket
851-XX-0_ _-10-002000
01-77
For RoHS compliance
select
plating code.
Fig. 3
Specify # of pins
Double Row
Fig. 4
Fig. 4
(Number of Pins
X .050”) + .040”
853-XX-_ _ _-10-001000
Specify # of pins
Single Row
Fig. 5
Specify # of pins
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
XX=Plating Code
See Below
SPECIFY PLATING CODE XX=
13
10µ” Au
30µ” Au
91
10µ” Au
93
30µ” Au
99
200µ”Sn/Pb
41
10µ” Au
43
44
Sleeve (Pin)
200µ” Sn/Pb
200µ” Sn/Pb 200µ”Sn/Pb
200µ”Sn
200µ”Sn
200µ”Sn
30µ” Au
200µ”Sn
Fig. 5
Contact (Clip)
w w w. m i l l - m a x . c o m
66
516-922-6000
MILL-MAX [ MILL-MAX MFG. CORP. ]
