20.0-36.0 GHz GaAs MMIC
Low Noise Amplifier
January 2010 - Rev 09-Jan-10
1.384
0.983
(0.039) (0.055)
0.785
1.184
(0.031) (0.047)
L1002-BD
Mechanical Drawing
1.950
(0.077)
2
3
4
5
1.288
(0.051)
1
6
0.658
(0.026)
0.0
0.0
10
9
8
7
0.785
(0.031)
1.184
(0.047)
1.384
(0.055)
2.350
(0.093)
0.983
(0.039)
(Note: Engineering designator is 28LN3BA0050)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.838 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (V1)
Bond Pad #3 (V2)
Bond Pad #4 (V3)
Bond Pad #5 (V4)
Bond Pad #6 (RF Out)
Bond Pad #7 (V8)
Bond Pad #8 (V7)
Bond Pad #9 (V6)
Bond Pad #10 (V5)
Bypass Capacitors
- See App Note [2]
Bias Arrangement
2
3
4
5
V1*
RF In
1
RF In
6
RF Out
XL1002-BD
RF Out
10
9
8
7
V5*
*V1 or V5 may be used, but both are not required.
V5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 9
Characteristic Data and Specifications are subject to change without notice.
©2010
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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