20.0-38.0 GHz GaAs MMIC
Balanced Mixer
February 2007 - Rev 26-Feb-07
M1004-BD
Mechanical Drawing
2.000
(0.079)
0.316
(0.012)
2
3
1
1.594
(0.063)
1.460
(0.057)
4
0.995
(0.039)
XM1004-BD
0.0
0.0
5
0.316
(0.012)
1.250
(0.049)
(Note: Engineering designator is 26BAM0545)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.550 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
Bond Pad #3 (LO)
Bond Pad #4 (Vg)
Bond Pad #5 (IF2)
Bias Arrangement
IF1
2
3
RF
LO
Bypass Capacitors
- See App Note [2]
1
4
Vg
XM1004-BD
5
IF2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
