XU1003-BD-000V 参数 Datasheet PDF下载

19.0-26.0 GHz GaAs MMIC

Transmitter

August 2007 - Rev 20-Aug-07

U1003-BD

1.678

(0.066)

2

Mechanical Drawing

1.945

(0.077)

1.608

(0.063)

1

2.478

(0.098)

3

3.278

(0.129)

4

5

1.487

(0.059)

0.0

0.0

10

9

8

7

6

1.678

(0.066)

2.478

(0.098)

3.077 3.278

(0.121) (0.129)

3.677 3.970

(0.145) (0.156)

(Note: Engineering designator is 22TX0523)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.

Bond Pad #1 (RF Out)

Bond Pad #2 (Vd1)

Bond Pad #3 (IF1)

Bond Pad #4 (Vd2)

Bond Pad #5 (LO)

Bond Pad #6 (Vg2b)

Bond Pad #7 (Vg2)

Bond Pad #8 (Vg2a)

Bond Pad #9 (IF2)

Bond Pad #10 (Vg1)

Bias Arrangement

Vd1

IF1

2

3

4

Bypass Capacitors

- See App Note [2]

Vd2

Vd2

Vd1

LO

IF1

RF

1

5

RF

LO

XU1003-BD

10

9

8

7

6

Vg1

IF2

Vg2

IF2

Vg1

Vg2

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Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2007

Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.