32.0-45.0 GHz GaAs MMIC
Transmitter
August 2006 - Rev 02-Aug-06
U1004
0.921
(0.036)
2
Mechanical Drawing
1.620
(0.064)
1.621
(0.064)
3
2.220
(0.087)
4
5
0.646
(0.025)
0.295
(0.012)
0.0
1
10
9
8
7
6
0.0
0.921
(0.036)
1.621
(0.064)
2.021
(0.080)
2.421
(0.095)
2.821
(0.111)
3.970
(0.156)
(Note: Engineering designator is 40TX0531)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.013 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF Out) Bond Pad #3 (IF1)
Bond Pad #2 (Vd1)
Bond Pad #4 (Vd2)
Bond Pad #5 (LO)
Bond Pad #6 (Vg4)
Bond Pad #7 (Vg2)
Bond Pad #8 (Vg3)
Bond Pad #7 (IF2)
Bond Pad #8 (Vg1)
Bias Arrangement
Vd1
IF1
2
3
4
Bypass Capacitors
- See App Note [2]
Vd1
Vd2
Vd2
IF1
5
LO
RF
LO
Vg4
RF
1
10
9
8
7
6
Vg1
IF2
Vg3
Vg2
Vg4
IF2
Vg1
Vg2
Page 3 of 7
Vg3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2006
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
