27.0-36.0 GHz GaAs MMIC
Transmitter
April 2007 - Rev 17-Apr-07
U1007-BD
2.533
2.933
1.133
Mechanical Drawing
(0.100)
(0.116)
(0.045)
1.750
(0.069)
4
3
2
XU1007-BD
1.231
1
(0.049)
0.555
5
(0.022)
7
6
8
9
0.0
2.933
2.533
3.333
3.500
0.733
(0.116)
(0.100)
(0.131)
(0.138)
(0.029)
0.0
(Note: Engineering designator is 27TRX0357)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.798 mg.
Bond Pad #1 (RF Out) Bond Pad #3 (IF1)
Bond Pad #5 (LO)
Bond Pad #6 (Vg3)
Bond Pad #7 (Vg2)
Bond Pad #8 (IF2)
Bond Pad #9 (Vd1)
Bond Pad #2 (Vg1)
Bond Pad #4 (Vd2)
Bias Arrangement
Bypass Capacitors - See App Note [2]
Vg1
Vd2
IF1
3
4
2
XU1007-BD
RF
1
LO
5
6
7
9
8
Vg2,3
Vd1
Page 3 of 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
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