18.0-21.0/36.0-42.0 GHz GaAs MMIC
Doubler and Power Amplifier
January 2007 - Rev 26-Jan-07
X1001-BD
Mechanical Drawing
0.295
(0.012)
1.700
(0.067)
2
0.694
(0.027)
1.095
(0.043)
1.494
(0.059)
2.096
(0.083)
2.705
(0.107)
3
4
5
6
7
0.605
(0.024)
1
8
0.638
(0.025)
14
0.0
0.0
0.295
(0.012)
13
0.695
(0.027)
12
1.095
(0.043)
11
1.495
(0.059)
10
2.096
(0.083)
9
2.503
(0.099)
3.000
(0.118)
(Note: Engineering designator is 20DBL0629)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (Vd5)
Bond Pad #7 (Vd6)
Bond Pad #8 (RF Out)
Vd3,4,5
Bond Pad #9 (Vg6)
Bond Pad #10 (Vg5)
Bond Pad #11 Vg4)
Bond Pad #12 (Vg3)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
Bypass Capacitors
- See App Note [2]
Vd6
Bias Arrangement
Vd2
Vg2
2
3
4
5
6
7
RF In
1
8
RF Out
14
13
12
11
10
9
Vg1
Vd1
Vg3,4,5
Vg6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.