This document was generated on 04/13/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
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Back Plate for Server Type 1.01mm (.040") Pitch LGA 1366 Processor Socket, Steel
General
Product Family
Series
Comments
Component Type
Product Name
Processor Sockets
Back Plate Assembly for Server Application
Back Plate Assembly
LGA1366
image - Reference only
ELV and RoHS
Compliant
Not Reviewed
Not Reviewed
Need more information on product
environmental compliance?
Series
Physical
Circuits (Loaded)
Circuits (maximum)
Durability (mating cycles max)
Material - Metal
Material - Plating Mating
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Temperature Range - Operating
Termination Interface: Style
0
0
30
Steel
Nickel
Tray
3.150 In
80.00 mm
3.15
80.00
-40°C to +88°C
Screw or Lug
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Electrical
Current - Maximum per Contact
Voltage - Maximum
0.8A
5V
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Material Info
Reference - Drawing Numbers
Sales Drawing
SD-47593-700
This document was generated on 04/13/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
MOLEX [ Molex Electronics Ltd. ]
