This document was generated on 05/17/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
Active
1.016mm (.040") by 1.016mm (.040") Pitch LGA Server CPU Socket, 0.38µm (15µ")
Gold(Au) Plating, 1366 Circuits, Lead-free
Documents:
Series
Processor Sockets
Socket
LGA1366
image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
General
Product Family
Series
Component Type
Product Name
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
1366
1,366
Black
30
Copper Alloy
Gold
Nickel
High Temperature Thermoplastic
Tray
0.040 In
1.02 mm
0.04
1.02
15
0.38
-40°C to +88°C
Solder or Weld
Search Parts in this Series
Electrical
Current - Maximum per Contact
Voltage - Maximum
0.8A
5V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
Reflow Capable (SMT only)
10
250
Material Info
Reference - Drawing Numbers
Packaging Specification
Product Specification
Sales Drawing
Test Summary
PK-47594-001, PK-47594-003
PS-47594-001
SD-47594-001, SD-47594-002
TS-47594-001
This document was generated on 05/17/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
MOLEX [ Molex Electronics Ltd. ]
