This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
Active
2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal
Module, 144 Circuits, Mounted Height 15.00mm (.591"), Pin Length 3.00mm (.118"),
Press Fit
Documents:
Series
image - Reference only
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
Style
Backplane Connectors
Daughtercard, Mezzanine
Press Fit Tail
PCB Receptacle
HDM®
N/A
RoHS Compliant by
Exemption
Not Reviewed
Not Reviewed
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
144
144
Black
250
No
No
None
Copper-Nickel-Tin
Gold
Tin-Lead
High Temperature Thermoplastic
24
Open Pin Field
6
Vertical
0.118 In
3.00 mm
No
None
0.063 In
1.60 mm
Tube
0.079 In
2.00 mm
0.079 In
2.00 mm
30
0.75
35
0.88
No
Yes
Yes
-55°C to +105°C
Search Parts in this Series
Mates With
HDM® Board-to-Board Backplane Header
Board Stacking Header 73769 , 73770 ,
MOLEX [ Molex Electronics Ltd. ]
