This document was generated on 05/10/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Description:
Active
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal
Pins, Black Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 2.67mm(.105")
Soldertail, 240 Circuits, Lead free
Documents:
Series
image - Reference only
LR19980
E29179
ELV and RoHS
Compliant
Contains SVHC: No
Not Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Agency Certification
CSA
UL
General
Product Family
Series
Component Type
JEDEC Outline
Product Name
Memory Module Sockets
Socket
MO-269
DDR3 DIMM
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
Function Key
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Pitch - Term. Interface (in)
Pitch - Term. Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
240
240
Black
25
Vertical
94V-0
None
Yes
Copper Alloy
Gold
Tin
High Temperature Thermoplastic
0.105 In
2.67 mm
Yes
Yes
0.062 In
1.57 mm
Tray
0.039 In
1.00 mm
0.039 In
1.00 mm
15
0.38
100
2.54
-55°C to +85°C
Through Hole
Search Parts in this Series
Mates With
JEDEC standard 1.27mm modules
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
1A
30V AC (RMS)/DC
Center
MOLEX [ Molex Electronics Ltd. ]
