1801 Morgan Street
Rockford, Illinois 61102
800-435-2931
www.molexkits.com
Datasheet for 76650-0192
Product Highlights continued
The High Density Metric (HDM) connector system is designed for applications that
require high interconnect density and high-speed signal integrity. Signal modules
of 72 and 144 contacts are available. Daughtercard modules are combined on a
metal stiffener so that they are handled as one connector. Special modules are
available for power, guidance, mounting and coding functions. These building
blocks can be combined to create very large connectors. Connectors of above
1000 circuits are not unusual. The power contacts can handle 15A of current per
power blade, efficiently delivering hundreds of watts in multiple voltage levels, even
in hot plug applications.
The IEEE 1386 standard contains the details for adding standardized PCI
mezzanine cards (PMC) to VMEbus and Multibus host boards. There are also
many LAN, WAN, telecommunications, PC and workstation users who want a
standardized mezzanine scheme and see the IEEE 1386 as the best approach.
The fully shrouded leaf-style design minimizes the chance of damaging plug
contacts. Our receptacle contacts feature a low mating force that reduces PCB
stress. Gold over Nickel contact plating enhances long-term reliability, while the
UL94V-0 LCP housings withstand SMT reflow processes.
Excellent tolerance absorption allows the connector to be used in combinations of
one to four mated pairs for up to 256 circuits. The connector design is hard-metric,
easy-mating, robust, surface-mounted and features high circuit density, with
excellent electrical performance. Along with that, it comes in a range of stacking
heights from 8.00 through 15.00mm (.315 through .591") for optimizing system
function.
The proven KK system of "building block" connectors can be used to create
thousands of different configurations. The Molex KK interconnection system can
provide all the options necessary to complement PC board interconnection design
requirements. For this reason, KK has become known as a versatile interconnecting
system developed to meet the challenge of modularization.
The Molex EBBI 50D series meets the market demand for low-cost, unshielded, high
density, leaf-style connectors. Several configurations are available including vertical,
right angle and blind-mating to provide valuable design flexibility and expandability.
Leaf-style terminals are arranged in two rows on .050" spacing within a polarized "D"-
shaped housing for rugged mechanical protection. Housings are made of high
temperature, UL 94V-0 thermoplastic. Terminals are plated with 30 micro-inches
min. gold in the mating area for long term reliability and durability.
** HDM® is a registered trademark of Amphenol Corporation
Features and Benefits
• Unique patented solder attach is more
cost effective and reliable than BGA
• SEARAY footprint is compatible with other
1.27mm(.050") by 1.27mm(.050") products
• Robust guidance and polarization aligns
connectors to mate in correct position
Applications
• High and Mid-Range Computers and Servers
• Medical Scanning Equipment
• Military
• Network Routers and Switches
• Mobile Base Stations
For additional Molex / Waldom Design and Solution Kits please go to www.molexkits.com
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