512K x 8 Static RAM
MSM8512C - 020
Issue 5.2 April 2001
Description
The MSM8512C is a 512K x 8 SRAM monolithic
device available in Chip Size BGA (Ball Grid Array)
package, with access times of 20ns. The device is
available to commercial and industrial temperature
grades.
The Chip Size BGA provides an ultra high density
memory packaging solution.
The Chip Size BGA occupies less than 50% of the
board area of conventional SOP, SOJ and TSOP II
packages.
Block Diagram
/CS
/OE
/WE
A0
A1
A2
A3
A4
A5
A6
A7
A8
512K x 8
SRAM
D0
D1
D2
D3
D4
D5
D6
D7
Features
• Access times of 20 ns.
• 5V + 10%, (3.3V Under Development)
• Commercial & Industrial temperature grades
• Chip Size BGA.
• 48 pad, 1mm pad pitch, package.
• Eutectic 63/67 solder ball attach.
• Low Power Dissipation.
Operating
1 W (max)
Standby (CMOS) 66mW (max)
• Completely Static Operation.
• 4 layer BT substrate with power and ground
planes.
• Pinout and footprint will remain the same in the
event of a die shrink.
Pin Definition
See page 2.
Pin Functions
Description
Address Input
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power
Ground
Signal
A0~A18
D0~D7
/CS
/WE
/OE
NC
V
CC
GND
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
Package Details
48D - 48 Ball, 1mm pitch Chip Size BGA
Max. Dimensions (mm) - 8.00 x 10.00 x 1.40
MOSAIC [ MOSAIC ]
