Customer Guidelines
Visual Inspection Standard
All devices inspected to ANSI 2 standard
Moisture Sensitivity
Devices are
moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40
O
C and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220
O
C)
must be
:
A : Mounted within 72 Hours at factory conditions of <30
O
C/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23
O
C +/-5% devices
require baking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125
O
C +/-5% for high temperature device containers
OR
B : 192 hours at 40
O
C +5
O
C/-0
O
C and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
Temp. exceeding 183
O
C
Peak Temperature
Time within 5
O
C of peak
Ramp down
Ramp up rate
Peak Temperature
Time within 5
O
C of peak
Ramp down
6
O
C/sec max.
150 secs. max.
225
O
C
20 secs max.
6
O
C/sec max.
6
O
C/sec max.
215 - 219
O
C
60 secs max.
6
O
C/sec max.
Vapour Phase -
Note : The above recomendations are based on standard industry practice. Failiure to comply with
the above recomendations invalidates product warranty.
PAGE 4
Issue 5.1 April 2001
MOSAIC [ MOSAIC ]
