LM350
MAXIMUM RATINGS
Rating
Input–Output Voltage Differential
Power Dissipation
Operating Junction Temperature Range
Storage Temperature Range
Soldering Lead Temperature (10 seconds)
Symbol
VI–VO
PD
TJ
Tstg
Tsolder
Value
35
Internally Limited
– 40 to +125
– 65 to +150
300
Unit
Vdc
W
°C
°C
°C
ELECTRICAL CHARACTERISTICS
(VI–VO = 5.0 V; IL = 1.5 A; TJ = Tlow to Thigh; Pmax [Note 1], unless otherwise noted.)
Characteristics
Line Regulation (Note 2)
TA = 25°C, 3.0 V
≤
VI–VO
≤
35 V
Load Regulation (Note 2)
TA = 25°C, 10 mA
≤
Il
≤
3.0 A
VO
≤
5.0 V
VO
≥
5.0 V
Thermal Regulation, Pulse = 20 ms,
(TA = +25°C)
Adjustment Pin Current
Adjustment Pin Current Change
3.0 V
≤
VI–VO
≤
35 V
10 mA
≤
IL
≤
3.0 A, PD
≤
Pmax
Reference Voltage
3.0 V
≤
VI–VO
≤
35 V
10 mA
≤
IO
≤
3.0 A, PD
≤
Pmax
Line Regulation (Note 2)
3.0 V
≤
VI–VO
≤
35 V
Load Regulation (Note 2)
10 mA
≤
IL
≤
3.0 A
VO
≤
5.0 V
VO
≥
5.0 V
Temperature Stability (Tlow
≤
TJ
≤
Thigh)
Minimum Load Current to
Maintain Regulation (VI–VO = 35 V)
Maximum Output Current
VI–VO
≤
10 V, PD
≤
Pmax
VI–VO = 30 V, PD
≤
Pmax, TA = 25°C
RMS Noise, % of VO
TA= 25°C, 10 Hz
≤
f
≤
10 kHz
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 3)
Without CAdj
CAdj = 10
µF
Long Term Stability, TJ = Thigh (Note 4)
TA= 25°C for Endpoint Measurements
Thermal Resistance, Junction–to–Case
Peak (Note 5)
Average (Note 6)
4
3
1,2
Figure
1
2
Symbol
Regline
Regload
–
–
Regtherm
IAdj
∆I
Adj
–
–
–
5.0
0.1
0.002
50
0.2
25
0.5
–
100
5.0
mV
% VO
% VO/W
µA
µA
Min
–
Typ
0.0005
Max
0.03
Unit
%/V
3
Vref
1.20
1.25
1.30
V
1
2
Regline
Regload
–
0.02
0.07
%/V
–
–
3
3
3
TS
ILmin
Imax
3.0
0.25
N
RR
–
66
3
S
R
θJC
–
–
–
–
20
0.3
1.0
3.5
70
1.5
–
10
mV
% VO
% VO
mA
A
4.5
1.0
0.003
–
–
–
% VO
dB
65
80
0.3
–
–
1.0
%/1.0 k
Hrs.
°C/W
–
–
2.3
–
–
1.5
NOTES:
1. Tlow to Thigh = 0° to +125°C; Pmax = 25 W for LM350T; Tlow to Thigh = – 40° to +125°C; Pmax = 25 W for LM350BT
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately.
Pulse testing with low duty cycle is used.
3. CAdj, when used, is connected between the adjustment pin and ground.
4. Since Long–Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability
from lot to lot.
5. Thermal Resistance evaluated measuring the hottest temperature on the die using an infrared scanner. This method of evaluation yields very
accurate thermal resistance values which are conservative when compared to the other measurement techniques.
6. The average die temperature is used to derive the value of thermal resistance junction to case (average).
2
MOTOROLA ANALOG IC DEVICE DATA
MOTOROLA [ MOTOROLA, INC ]
