MC33154
MAXIMUM RATINGS
Rating
Power Supply Voltage
to V ; V ≤ KGND ≤ V
Symbol
Value
Unit
V
V
CC
V
– V
20
20
EE EE
CC
CC
EE
EE
Kelvin Ground to V
(Note 1)
KGnd – V
EE
Input
Current Sense Input
V
V
EE
–0.3 to V
CC
V
V
V
A
in
V
–0.3 to V
CS
BD
CC
CC
Fault Blanking/Desaturation Input
V
–0.3 to V
Gate Drive Output
Source Current
Sink Current
I
O
4.0
2.0
1.0
Diode Clamp Current
Fault Output
Source Current
Sink Current
I
mA
FO
25
10
Power Dissipation and Thermal Characteristics
D Suffix SO–8 Package, Case 751
Maximum Power Dissipation @ T = 50°C
Thermal Resistance, Junction–to–Air
P Suffix DIP–8 Package, Case 626
P
0.56
180
W
°C/W
A
D
R
θJA
Maximum Power Dissipation @ T = 50°C
P
D
1.0
W
A
Thermal Resistance, Junction–to–Air
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature Range
R
100
°C/W
θJA
T
150
°C
°C
°C
J
T
–40 to +85
A
T
–65 to +150
stg
.
NOTES: 1. Kelvin Ground must always be between V
and V
EE
CC
2. ESD data available upon request.
ELECTRICAL CHARACTERISTICS (V
= 20 V, V
= 0 V, Kelvin Gnd connected to V . For typical values
EE EE
CC
T
= 25°C, for min/max values T is the operating ambient temperature range that applies [Note 1] unless otherwise noted.)
A
A
Characteristic
Symbol
Min
Typ
Max
Unit
INPUT
Input Threshold Voltage
V
High State (Logic 1) @ T = 25°C
V
9.0
7.0
10.5
11.6
–
A
IH
High State (Logic 1) @ T = –40 to +85°C
A
Low State (Logic 0)
V
4.5
IL
Input Current — High State (V = 10.5 V)
IH
I
I
–
–
100
50
500
100
µA
IH
IL
Input Current — Low State (V = 4.5 V)
IL
GATE DRIVE OUTPUT
Output Voltage
V
Low State (I
= 1.0 A)
V
–
17
2.0
18
2.5
–
Sink
High State (I
OL
= 2.0 A)
V
OH
Source
Output Pull–Down Resistor
R
–
100
200
kΩ
PD
FAULT OUTPUT
Output Voltage
V
Low State (I
= 5.0 mA)
V
–
17
0.2
18.3
1.0
–
Sink
High State (I
FL
= 20 mA)
V
FH
Source
SWITCHING CHARACTERISTICS
Propagation Delay (50% Input to 50% Output C = 15 nF)
L
Logic Input to Drive Output Rise
Logic Input to Drive Output Fall
ns
t
t
–
–
200
120
300
300
PLH (in/out)
PHL (in/out)
Drive Output Rise Time (10% to 90%) C = 15 nF
t
–
–
80
80
200
200
ns
ns
µs
L
r
Drive Output Fall Time (90% to 10%) C = 15 nF
L
t
f
Propagation Delay
Current Sense Input to Drive Output
t
–
0.4
1.0
P(OC)
NOTE: 1. Low duty cycle pulse techniques are used during test to maintain the junction temperature as close to ambient as possible.
= –40°C for MC33154 = +85°C for MC33154
T
T
high
low
2
MOTOROLA ANALOG IC DEVICE DATA